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| VSM1206 Vishay Foil Resistors SURFACE MOUNT Bulk Metal(R) Foil Technology Discrete High Precision Surface Mount Chip Resistor FEATURES * High Precision: Tolerance to 0.01% (see table 1) * Low Temperature Coefficient of Resistance: Nominal TCR: + 0.5ppm/C (- 55C to + 125C) * Resistance Range: 10 to 30K Product may not be to scale * Load Life Stability: 0.01% maximum R under full rated power at + 70C for 2000 hours. * Shelf Life Stability: 50ppm/year (0.005%) maximum R non-hermetically sealed * Power Rating at + 70C: 125mW * Maximum Working Voltage: 61V * Maximum Weight: 11mg * Voltage Coefficient: < 0.00001%/volt (< 0.1ppm/V) * Current Noise: < 0.01V(rms)/volt of applied voltage * Non Inductive: < 0.08nH The VSM1206 Precision Surface Mount Chip Resistor utilizes Ultra Precision Bulk Metal(R) Z Foil (BMZF) for the resistive element. The BMZF technology provides inherently an extremely low and predictable Temperature Coefficient of Resistance (TCR), remarkable load life stability, low noise and availability of tight tolerance. The TCR is a process capability not a selection process and for most of the range is independent of ohmic value and lot related variations. The TCR curve on Fig. 1 demonstrates the new revolutionary Z Foil with its TCR nominal of 0.5ppm/C. A voltage divider can be fashioned by using two arbitrarily selected VSM1206s with a resultant tracking specification of < 3ppm/C. Extremely low tracking of < 1ppm/C can be supplied upon request. The VSM1206 has a conventional full wrap around robust termination which insures safe handling during manufacturing process, as well as providing stability during the multiple thermal cyclings it will see over its service life. The availability of tight absolute tolerance provides a good cost solution for the variability of other components when compiling the total error budget. BMZF offers the best stability available; and is more than an order of magnitude better than thin film technology. The noise generated by the resistor is non measurable and its design and construction make it well suited for high frequency applications. The BMZF is the ultimate resistor component for analog applications. VISHAY FOIL * FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 * GERMANY +49.9287.710 FAX: +49 9287.70435 * ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 TABLE 1 TOLERANCE AND TCR VS RESISTANCE VALUE VALUE () 100 to 30K 50 to < 100 25 to < 50 STANDARD TOLERANCE* (%) 0.01 0.05 0.1 MAXIMUM TCR** 2ppm/C 3ppm/C 3ppm/C 10 to < 25 0.25 4ppm/C *Tighter tolerances are available. Please contact Vishay Application Engineering. **Over MIL range (- 55C to + 125C, + 25C reference) FIGURE 1 - NOMINAL TCR CURVE R R (PPM) + 150 + 100 + 50 0 - 50 - 100 - 150 - 200 - 50 - 55 - 25 0 + 25 + 50 + 75 + 100 + 125 Z Foil 0.5PPM/C Ambient Temperature (C) The TCR for values < 100 are influenced by the termination composition and result in a deviation from this curve. * ITALY + 39.2.300.11919 FAX: +39.2.300.11999 * JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 * SINGAPORE +65.788.6668 FAX: +65.788.0988 * SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 * UK +44 191 514 8237 FAX: +44 1953 457 722 * USA +1 610 407-4800 FAX: +1 610 640-9081 www.vishay.com 24 Document Number: 63090 Revision 21-May-03 VSM1206 Bulk Metal Foil Technology Vishay Foil Resistors Discrete High Precision Surface Mount Chip Resistor (R) SURFACE MOUNT TABLE 2 - TYPICAL PERFORMANCE SPECIFICATIONS TEST MIL-PRF-55342G VSM1206 CHARACTERISTIC E MAXIMUM R LIMITS R LIMITS* 0.10% 0.10% 0.10% 0.10% 0.20% 0.20% 0.50% 0.02% 0.02% 0.02% 0.03% 0.01% 0.03% 0.01% FIGURE 2 - DERATING CURVE Percent of Rated Power 125 100 75 50 25 0 -75 -55C +70C Rated Power Thermal Shock Low Temperature Operation Short Time Overload High Temperature Exposure Resistance to Bonding Moisture Resistance Life 2000 hours @ + 70C -50 -25 0 +25 +50 +75 +100 +125 +150 +175 Ambient Temperature (C) FIGURE 3 - RECOMMENDED MOUNTING *As shown + 0.01 Ohms to allow for measurement errors at low values. 25% to 85% of T A low profile solder fillet is recommended to avoid unnecessary stresses along top edge of metallization. IR and vapor phase reflow are best. Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction. TABLE 3 - DIMENSIONS AND LAND PATTERN in inches (millimeters) Bottom View for Mounting Uncoated Ceramic L X T D W G Z Footprint Recommended Land Pattern L 0.005 [0.13] 0.126 [3.2] W 0.005 [0.13] 0.062 [1.57] T MAXIMUM 0.025 [0.64] D 0.005 [0.13] 0.020 [0.50] Z* MAXIMUM 0.175 [4.4] G* MINIMUM 0.059 [1.5] X* MAXIMUM 0.071 [1.806] *Land Pattern Dimensions are per IPC-782 TABLE 4 - ORDERING INFORMATION MODEL VSM CHIP SIZE 1206 RESISTANCE RANGE RESISTANCE VALUE LETTER DESIGNATOR MULTIPLIER FACTOR x 1.0 TOLERANCE T 0.01% Q 0.02% A 0.05% B 0.1% C 0.25% D 0.5% F 1.0% TERMINATION B = Solderable PACKAGING T = Tape and Reel W = Waffle Pack 10 to < 1K R Example: 249R00 = 249 1K to 30K K x 103 Example: 10K000 = 10.0K VISHAY FOIL * FRANCE +33.4.93.37.28.24 FAX: +33.4.93.37.27.31 * GERMANY +49.9287.710 FAX: +49 9287.70435 * ISRAEL +972.3.557.0945 FAX: +972.3.558.9121 * ITALY + 39.2.300.11919 FAX: +39.2.300.11999 * JAPAN +81.3.5464.6411 FAX: +81.3.5464.6433 * SINGAPORE +65.788.6668 FAX: +65.788.0988 * SWEDEN +46.8.594.70590 FAX: +46.8.594.70581 * UK +44 191 514 8237 FAX: +44 1953 457 722 * USA +1 610 407-4800 FAX: +1 610 640-9081 Document Number: 63090 Revision 21-May-03 www.vishay.com 25 |
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